Multi-material three-dimensional printer with underlying adjustable binder

ABSTRACT

A jetted binder printing system includes a carrier substrate configured to travel along a longitudinal direction thereof, an adjustable binder printer configured to deliver an adjustable binder to the carrier substrate, a dispensing module located downstream from the adjustable binder printer on the longitudinal direction of the carrier substrate, the dispensing module including at least one powder container, the dispensing module being configured to dispense powder onto the carrier substrate, and a primary binder printer located downstream from the compaction module along the longitudinal direction of the carrier substrate. The primary binder printer includes a print head configured to print a primary binder on the dispensed powder according to a desired pattern. The primary binder is printed on a surface of the powder that is opposite a surface on which the adjustable binder is printed. The primary binder is printed to match the pattern of the adjustable binder.

TECHNICAL FIELD

This application relates to three-dimensional (3D) printing using jettedbinder printers, particularly to the application of an adjustable binderto the carrier substrate prior to powder deposition.

BACKGROUND

Three-dimensional (3D) printing has generated a high degree of interestin the potential for a faster and more economical manufacturingapproach. Today, the majority of 3D printers are used to makedemonstration parts or nonfunctional prototypes, most from a plasticmaterial that is chosen primarily for compatibility with the printerrather than the materials requirement of the final part. Among theissues hampering a wider acceptance of 3D printing as a commerciallyviable manufacturing method is the requirement of specific applicationsfor specific materials compatible with these applications.

The most common 3D printing techniques typically create a patterned 3Dobject by stacking patterned layers that are directly patterned onpreviously created layers. This approach has advantages in simplifyingthe 3D object creation process by generally not requiring manipulationof the patterned layers between, e.g., the pattern generation step andthe assembly step. Additionally, in powder bed-based processes, in situpattern generation facilitates the creation of the first layer of powderand allows the first patterned layer to be on a bed of several layers ofpowder that are confined by a build box. Generating a controlled andstable layer of fine powder on a necessarily smooth surface is typicallydifficult because the powder may be easily displaced by smoothing orotherwise conditioning the loose powder layer. Powder that is stabilizedby a uniform bed of powder below it and the confinement of the build boxcan be more uniform and stable.

Disadvantages of in situ creation of patterned layers presents manyproblems that may limit the capabilities of powder bed-based 3Dprinters. The limitations of in situ build include, e.g., being limitedto a single material to avoid cross-contamination, an inability tocondition the powder layer to obtain desired and consistent density ofthe powder layer, the inability to use more than a single patterngeneration method to optimize layer thickness and feature precision, andan inability to reject or correct a defective layer before it isincorporated into the complete printed part. Methods that allow for theseparation of the pattern generation step and assembly step may beadvantageous by avoiding the above disadvantages. Implementing anadjustable binder layer may allow to create a stable, uniform andtransferrable layer of patterned powder directly on a carrier substrate.

SUMMARY

In one general aspect, the instant application describes a jetted binderprinting system that includes a carrier substrate configured to travelalong a longitudinal direction thereof; an adjustable binder printerconfigured to deliver an adjustable binder to the carrier substrate; adispensing module located downstream from the adjustable binder printeron the longitudinal direction of the carrier substrate, the dispensingmodule including at least one powder container, the dispensing modulebeing configured to dispense powder onto the carrier substrate; acompaction module located downstream from the dispensing module alongthe longitudinal direction of the carrier substrate, the compactionmodule being configured to apply a controlled pressure, in a directionsubstantially orthogonal to the longitudinal direction of the carriersubstrate, to increase a compaction of the dispensed powder to a desiredcompaction range; and a primary binder printer located downstream fromthe compaction module along the longitudinal direction of the carriersubstrate, the primary binder printer including a print head configuredto print a primary binder on the dispensed powder according to a desiredpattern; wherein the primary binder is printed on a surface of thepowder that is opposite a surface on which the adjustable binder isprinted; and wherein the primary binder is printed to match the patternof the adjustable binder.

The above general aspect may include one or more of the followingfeatures. For example, the adjustable binder is compatible with theprimary binder, is configured to maintain a position of the powder, oris configured to provide adhesion to the powder and to the primarybinder.

For another example, the jetted binder printer system further includes afusion module positioned downstream from the primary binder printeralong the longitudinal direction of the carrier substrate, the fusionmodule including an energy source and being configured to causeselective fusion of the material layer according to the desired pattern;a material removal module positioned downstream from the fusion modulealong the longitudinal direction of the carrier substrate, the materialremoval module including a plurality of material removal devices andbeing configured to remove non-fused portions of the material layer toform one or more patterned single-layer objects; a transfer modulelocated downstream from the material removal module along thelongitudinal direction of the carrier substrate, the transfer moduleconfigured to transfer one of the patterned single-layer objects fromthe carrier substrate to an assembly plate; an assembly stationcomprising the assembly plate, the patterned single-layer objects beingassembled into a stack on the assembly plate according to a desiredsequence of objects including the patterned single-layer objects; and acontroller to control the desired sequence and desired patterns.

For a further example, the carrier substrate is a belt, or furtherincludes an adhesion control layer on which the material layer isformed, and the dispensing module includes one or more powder containersconfigured to contain a fluidized powder in a desired controlledcondition.

As an additional example, the dispensing module includes one or moredispensing controllers configured to meter a desired amount of powderdispensed onto the carrier substrate, the dispensing rollers beingconfigured to spread the powder on the carrier substrate, and thecompactor module includes a vibratory energy source to cause settling ofthe powder.

For another example, the assembly station further includes a lateralpositioner to laterally displace the assembly plate, and a verticalpositioner to vertically displace the assembly plate, and the carriersubstrate includes a fiducial marker for each of the patternedsingle-layer objects; and the assembly station comprises an alignmentsensor to align the fiducial markers to the assembly plate.

In another general aspect, the instant application describes a method ofmanufacturing a three-dimensional object includes dispensing anadjustable binder on a longitudinal surface of a carrier substrateaccording to a desired pattern; dispensing a powder on the adjustablebinder on the carrier substrate; compacting the powder to a desiredcompaction range; dispensing a primary binder on the compacted powderaccording to the desired pattern; selectively fusing the compactedpowder according to the desired pattern; and removing non-fused portionsof the compacted powder to form one of a patterned single-layer object.

The above general aspect may include one or more of the followingfeatures. For example, the method further includes transferring thepatterned single-layer object from the carrier substrate to an assemblyplate; and repeating the dispensing the adjustable binder, thedispensing the powder on the adjustable binder, the compacting thepowder, the dispensing the primary binder, the selectively fusing thecompacted powder and the removing the non-fused portions, to form apatterned multi-layer object.

For another example, dispensing the adjustable binder comprises defininga position of the powder, and dispensing the powder includes adheringthe powder to the adjustable binder at the defined position.

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used to limit the scope of the claimed subject matter. Furthermore,the claimed subject matter is not limited to implementations that solveany or all disadvantages noted in any part of this disclosure.

Additional advantages and novel features of these various generalaspects will be set forth in part in the description that follows, andin part will become more apparent to those skilled in the art uponexamination of the following or upon learning by practice of theinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawing figures depict one or more implementations in accord withthe present teachings, by way of example only, not by way of limitation.In the figures, like reference numerals refer to the same or similarelements. Furthermore, it should be understood that the drawings are notnecessarily to scale.

FIG. 1 is a flow chart illustrating a process for 3D inkjet printing,according to various implementations.

FIG. 2 is an illustration of a 3D jetted binder printer, according tovarious implementations.

FIG. 3 is an illustration of a carrier substrate, according to variousimplementations.

FIG. 4 is a diagram of a computer system configured to control a 3Djetted binder printer, according to various implementations.

FIG. 5 is a schematic of a print station controller for use with a 3Djetted binder printer, according to various implementations.

FIG. 6 is a block diagram of an example computing device configured toprovide implementations of the systems and methods described herein.

FIG. 7 is a block diagram illustrating components of an example machineconfigured to read instructions from a machine-readable medium.

DETAILED DESCRIPTION

In the following detailed description, numerous specific details are setforth by way of examples in order to provide a thorough understanding ofthe relevant teachings. However, it should be apparent that the presentteachings may be practiced without such details. In other instances,well known methods, procedures, components, and/or circuitry have beendescribed at a relatively high-level, without detail, in order to avoidunnecessarily obscuring aspects of the present teachings.

3D printing presents a technical problem where the ability to depositrelatively thick layers, limits its usefulness when precise thin layersare needed, and there typically is a lack of precision in the depositionlocation of the powder. To address these technical problems and more, inan example, this description provides a technical solution for 3D jettedbinder printers that are designed to create printed objects, printedlayers and printed parts using combinations of materials and processesnot typically associated with jetted binder printing.

A basic process for manufacturing a 3D printed part typically may begin,e.g., with a CAD file fully defining the structure, materials andspecifications of the desired part. The part described in the CAD filemay be sliced into print pattern layers, the thickness of each layerdetermined by specifications for each position within the printed part,such as final thickness and pattern tolerance. Each layer may then beseparated into regions, which may require different materials. Printercontrol instructions for each of the regions of different materialrequirement may then be transferred from the design file via inputdevice and central processing unit and interface bus to appropriateprint station control units of the jetted binder printer system. As usedherein, a “printed part” includes any assemblage of printed subparts orlayers which may be fused together to form the part. Such an assemblagemay be referred to as a “printed part” before or after fusing togetherits constituent parts. As used herein, a “printed layer” includes alayer of one or more materials, one voxel thick, which may have ahorizontal design conforming to a design of a desired location within adesired printed part. In an implementation, a voxel is an array ofelements of volume that constitute a notional three-dimensional space.

FIG. 1 is a flow chart illustrating a process for 3D jetted binderprinting, according to various implementations. The method starts atS110, where an adjustable binder is deposited on a carrier substrate.For example, the adjustable binder is deposited on the carrier substratewhile the carrier substrate is in movement via, e.g., a first inkjetprint head. In various implementations, prior to powderdeposition/recoat/conditioning, a layer of an adjustable binder materialmay be deposited on the carrier substrate via, e.g., ink jetting, in thesame or exact pattern of the printed object. The adjustable binder maybe treated to prepare for deposition of the powder thereon via, forexample, exposure to a radiation source to modify the viscosity of thedeposited layer of adjustable powder, or incorporating a reactivematerial in the deposited layer to modify the flow characteristics ofthe deposited layer.

Once the adjustable binder is deposited on the carrier substrate, atS120, the method deposits a powder or powder layer onto the adjustablebinder that is deposited on the carrier substrate using, e.g., a powderdispenser. Powder may be metered onto the entire active area of thecarrier substrate in an amount calculated to uniformly cover the activearea with powder that will result in a desired thickness of powder afterthe conditioning step. The amount of adjustable binder deposited in theprevious step may be sufficient to wet all the powder deposited, or itmay be enough adjustable binder to wet only a lower portion of thedeposited powder. The adjustable binder/powder composite may be designedto form a temporary bond between the adjustable binder/powder compositeand the carrier substrate in order to maintain the as-deposited positionof the adjustable binder/powder composite during subsequent operations,until the printed object is released from the carrier substrate andjoined to a printed part.

At S130, both the deposited powder and the adjustable binder areconditioned in order to increase the density of the powder. For example,the powder may be conditioned by compacting to a predetermined densitywith a device such as a pressure cuff, by exposure to an energy sourcesuch as e.g., UV, IR, X-ray, or by exposure to particles such as, e.g.,electrons.

At S140, a primary binder is deposited on the powder to e.g., form apatterned layer. After the powder has been deposited on the adjustablebinder, recoated and conditioned, the primary binder deposition devicemay deposit the primary binder in precise alignment with the underlyingpowder and adjustable binder. For example, the volume of the adjustablebinder may be select to be sufficient to stabilize and hold the powderin place, but not sufficient to fully wet the powder and provide anadhesive surface for the attachment to a subsequent layer. In that case,the primary binder simply wets the top, unwet layer of powder to provideuniform binding action throughout the powder layer in both theadjustable binder and the primary binders are formulated to readily wetthe powder.

In various implementations, the adjustable binder may be or include thesame material as the primary binder, or it may be or include a differentbut compatible material. For example, the adjustable binder and theprimary binder may not adversely react, e.g., chemically react with eachother to deteriorate each other, or to deteriorate the powder that issandwiched between the adjustable binder and the primary binder.Furthermore, the primary binder and the adjustable binder may also becompatible during the sintering process, e.g., with respect to burn-outrates characteristics such that they do not interact destructivelyduring the sintering process. The primary binder and the adjustablebinder may also be compatible with the same sintering atmosphere suchthat one or the other or both do not leave unacceptable or deleteriouscontaminates behind after the sintering process of the powder andbinders is complete. The adjustable binder layer may be a thin layer,mostly interacting or adhering with the bottom layer of powderparticles. In implementations, the adjustable binder may be the solebinder consolidating the printed object.

In various implementations, a material of the adjustable binder may beselected to be adjustable in terms of adhesion strength by a form ofenergy exposure, i.e., the adhesion of the adjustable binder to theoverlaying powder may be adjusted by exposing the adjustable binder toirradiation such as, e.g., heat. The adjustment in the adhesion of theadjustable binder may be performed to provide a desired adhesion of theadjustable binder to the carrier, the adhesion of the adjustable binderto the powder, or the adhesion of the adjustable binder to both thecarrier and to the powder. The energy irradiated onto the adjustablebinder may be electrical energy, thermal energy, electromagnetic energy,or mechanical energy.

In various implementations, the adjustable binder and the primary bindermay be deposited from the same multi-material printhead, or each of theadjustable binder and the primary binder may be deposited from aseparate printhead. In either case, alignment of the primary binder andof the adjustable binder position may be ensured by any one of severalalignment strategies and systems configured to maintain a preciselocation of the substrate upon which the adjustable binder is depositedand to move the pattern into alignment with the known position of theprimary binder print head.

In various implementations, the position of the pattern of theadjustable binder may be known by providing encoders configured to readthe position of the carrier substrate. Another method of alignment ofthe adjustable binder to the primary binder print head may use alignmentfiducials incorporated in either the adjustable binder pattern or in thesubstrate on which the adjustable binder is deposited. The position ofthe fiducials may be detected by sensors in known positions relative tothe primary binder print head, and the location of the adjustable bindermay be adjusted to precise alignment with the primary binder print headbased on the location data from the sensors. Other methods of alignmentmay also be utilized.

Various implementations include saturating a thin layer of powder fromboth surfaces, i.e., upper surface and lower surface, of the powderlayer with deposits of binder. The binder at the lower surface may be anadjustable binder, and the binder at the upper surface may be a primarybinder. The adjustable binder and the primary binder may be different orthe same. Saturating the thin layer of powder with the binders may beperformed via a jetted binder-based printer. The surface of thedeposited powder layer that is in contact with a carrier substrate maybe treated with a material that may adjust the adhesion of the powderlayer to the carrier substrate, or the adhesion of the powder layer tothe binders. Individual steps of the pattern generation process may beaddressed with more precision to select appropriate agents for eachstep. For example, the adjustable binder may be selected to maintain theposition of the powder as deposited thereon while increasing adifference in adhesion between a powder with a primary binder and apowder without the primary binder, which facilitates the removal of thepowder that is not intended to remain with the printed object. In otherwords, the adjustable binder makes it easy to remove powder that is notdesigned to be printed on the carrier substrate. The selection of theadjustable binder may also improve the transfer of the resulting printedobject from the carrier substrate to, e.g., a build station.

At S150, a curing process may be applied to the deposited printed layerin order to rapidly dry the printed layer. For example, both theadjustable binder and the primary binder may be cured and set byapplying an energy source such as, e.g., ultraviolet (UV), infra-red(IR) or microwave radiation, or by applying particles such as electronsor chemical catalysts. Once the curing step is complete, the powder thatis not exposed to the jetted binders may be removed at S160.Accordingly, any loose powder may be removed by, e.g., using amechanical disrupter, an air knife, a vacuum port, and the like. Oncethe unexposed powder is removed at S160, the printed layer istransported to a build station at S170, where it is transferred to astack of previously printed layers or, for the first layer printed,begins a new stack on the build station. This process may be repeateduntil all layers of the desired printed part have been transferred tothe build station at S170. Once the completed part is assembled on thebuild plate, the completed part is removed from the build plate at S180,and is placed in a furnace for sintering or other maturation step suchas, e.g., a polymerization step by application of heat or other energysource, at S190.

FIG. 2 illustrates some of the basic components of a 3D printer system.For simplicity only one of a plurality of printer modules A and transfermodules B are represented in FIG. 2 . FIG. 2 further illustrates apossible relationship between printer module A, transfer module B andassembly apparatus C.

Jetted Binder Printer Module

In various implementations printer module A of FIG. 2 is represented asa jetted binder printer module and includes components to create aprinted object from a powdered material, conforming to a desiredphysical specification. A jetted binder printer module may create aprinted object on a carrier substrate 200 of transfer module B.

Adjustable Binder

In various implementations, a dedicated adjustable binder printer 45 maybe provided, upstream in the direction of travel from dispensing moduleor device 20, i.e., ahead of the powder dispensing module or device 20on the carrier substrate 200 in a longitudinal direction of movement ofthe carrier substrate 200. In this case, the carrier substrate 200 maymove in only the direction of travel indicated in FIG. 2 as going fromright to left. In this implementation, adjustable binder printer 45 maydeposit the adjustable binder on the carrier substrate 200 in a desiredpattern before the carrier substrate 200 moves the adjustable binderpattern under the dispensing module or device 20 where fluidized powdermay be dispensed over the adjustable binder pattern. From there, thecarrier substrate 200 may transport the adjustable binder pattern havingthe flowable powder thereon through the compaction module (also referredto as compactor device or the conditioning device) 30 to compact theflowable powder and adjustable binder to a desired density. The carriersubstrate 200 may then transport the adjustable binder/flowable powderstructure to the alignment module (also referred to as alignment deviceor alignment sensor) 35 so that the adjustable binder/flowable powderstructure may be aligned such that primary binder printer 40 may depositprimary binder in precise alignment with the pattern of adjustablebinder in the adjustable binder/flowable powder structure. Accordingly,the adjustable binder is deposited on the carrier substrate 200, and thecarrier substrate 200 proceeds to the powder deposition recoating andconditioning steps prior to arriving to the location of the primarybinder printer 40 where the primary binder is deposited to match theexact X/Y pattern of the adjustable binder but on the opposite surfaceof the deposited powder. Thus, the deposited powder is wetted on a firstsurface by the adjustable binder, and subsequently on a second surfaceby the primary binder. The total amount of binder may be determined tobe sufficient to fix most or all of the powder in the proper positionwithout forming a film covering either the first surface or the secondsurface of the powder.

In one implementation, for each powder, the relative volumetricconcentration and wetting properties of the powder, as recoated, may beknown. Based on the relative volumetric concentration and wettingproperties of the powder, the volume of adjustable binder that may filland wet the powder to desired levels may be calculated. As an example ofsuch calculation, the absolute volume of powder to be incorporated in aprinted object may be known, and the density to which the powder is tobe compacted by the compaction module may also be known, from which theopen volume in the compacted powder may be calculated. If the objectiveis to wet 50% of the powder with adjustable binder, then the adjustablebinder print head may be controlled to deposit adjustable binder in anamount equal to 50% of the projected open volume of the compactedpowder, in a uniform layer. A single print head, with capability todeposit both the adjustable binder and the primary binder, may be used.For example, the carrier substrate 200 may travel first to the binderdeposition location at the adjustable binder printer 45 where theadjustable binder capability is used to deposit a pattern of adjustablebinder, before the carrier substrate 200 travels to the powderdispensing module or device 20 to have powder deposited over theadjustable binder, recoated and conditioned. Finally, the carriersubstrate 200 may return to the binder deposition location at theadjustable binder printer 45, where instead of the adjustable binder,the primary binder may be deposited on the powder and adjusted so thatthe primary binder, as it is absorbed by the powder, effectively createsthe desired pattern of powder wetted by the adjustable binder.Accordingly, the primary binder may be substantially prevented fromspreading, or wicking out, beyond the powder pattern.

The carrier substrate 200 may remain static, i.e., in a fixed location,through the entire process including the adjustable binder deposition,the powder deposition, the recoating/conditioning, and the primarypowder deposition. For example, the adjustable binder deposition device,the powder deposition and recoating device, the conditioning device, andthe primary binder deposition device may be moved, in turn, intoalignment with the static carrier substrate 200 to deposit theadjustable binder, deposit and recoat powder, condition the powder andto deposit a desired aligned pattern of primary binder to the secondside of the powder.

The printer module A may include a dispensing module or device 20 at adistal end thereof. Herein, dispensing device and dispensing module areused interchangeably. The dispensing module or device 20 may simply be adispenser configured to dispense fluidized material. The dispensingmodule or device 20 may include a materials storage device 24 and adispensing controller 22. The dispensing controller 22 may be configuredto meter a desired amount of fluidized material onto a carrier substrate200. The dispensing controller 22 may also be configured to preciselycontrol the uniformity of the deposited fluidized material. Thedispensing module may include a roller to spread the fluidized particlesor powder on the carrier substrate. In some implementations, thedispensing device 20 may include a plurality of material storage devices24.

Also as part of the printer module A, a compaction device 30 may beprovided. The compaction device 30 is sometimes referred to as acompaction module 30. The compaction device 30 is positioned downstreamfrom the dispensing module along the direction of travel. In someimplementations, the compaction device 30 may include a roller, made upof a hardened metal material designed as a cylindrical tube. In otherimplementations, the compaction device 30 may include a compliantpressure cuff, or another device configured to apply a controlledpressure orthogonal to the plane of the deposited fluidized material andthe carrier substrate 200. The compaction device 30 may also include asettling device configured to provide vibration. The vibration of thecompaction device 30 may improve the distribution and compaction of thefluidized material. In some implementations, the compaction device 30may be configured to compact a fluidized material to a high density ofat least 40% of the theoretical density of the fluidized material.

Printing Device

In various implementations, near the distal end of the carrier substrate200, a primary binder printer 40 may be included. The binder printer maybe positioned downstream from the compaction module along the directionof travel of the carrier substrate 200. The primary binder printer 40may be configured to deposit a liquid binding material to fix a desiredpattern into a fluidized material. The precise pattern may be fixed intothe fluidized material by binding the fluidized material into aconnected and robust mass. In some implementations, the primary binderprinter 40 may be an ink jet type print head under direct control of acomputer system as described below in FIGS. 4-7 . The computer systemmay be instructed using a set of patterning instructions, for instance adesired CAD (computer aided design) program.

The primary binder printer 40 may include an ink jet type print headwith jetting nozzles spanning the width of the carrier substrate 200.The ink jet type print heads may also be provisioned at a sufficientdensity to achieve a desired print resolution. The ink jet type head maybe fixed in position and the functioning of each jetting nozzle may becoordinated with the movement of the carrier substrate 200 to create thedesired pattern in the fluidized material. Movement of carrier substrate200 relative to primary binder printer 40 may be implemented by proximalbuffer 212 and transfer drive motor 250. Additional buffers may bepositioned between proximal buffer 212 and distal buffer 210, to moreprecisely control the interaction between the developing 3D printedobject and any of the components of the jetted binder printer module.

The primary binder printer 40 may include one or more commerciallyavailable print heads. For example, the primary binder printer 40 mayinclude an array of print heads with a wide range of properties toaccommodate an anticipated range of requirements. In an implementation,the primary binder printer 40 may deliver a measured and adjustablevolume of binder to a target voxel of the printed object with a pulse ofthe print head. The primary binder printer 40 may deliver one or moremeasured volume to each voxel under control of the computer system.

Alignment Device

In various implementations, the printer module A includes an alignmentdevice 35 (also referred to as alignment sensor) which provides theability of carrier substrate to move in two directions, i.e., twodirections X-Y that are parallel to the longitudinal plane of thecarrier substrate 200. The alignment device 35 may allow the primarybinder printer 40 to dispense an adjustable binder pattern. Thealignment device 35 may also allow the primary binder printer 40 to moveagainst the direction of travel to have fluidized powder dispensed fromdispensing module or device 20 into the adjustable binder pattern. Thealignment device 35 may also allow the primary binder printer 40 toreverse the direction of travel to go through compaction device 30,under alignment device 35 and on to primary binder printer 40 where thebinder printer will dispense the primary binder. Specifically, thealignment device or sensor determines the exact position of theadjustable binder/powder object so that an alignment actuator can adjustthe relationship between the binder/powder object and the printhead suchthat the printhead can deposit the primary binder in a pattern exactlyas desired in relation to the adjustable binder/powder object. Theadjustment of the relative relationship between the printhead and theadjustable binder/powder object may be facilitated in the directionparallel to the direction of travel, by action of the proximal buffer212, the distal buffer 210 and the transfer drive motor 250. Adjustmentsin the direction orthogonal to the direction of travel may befacilitated by an actuator configured to drive the printhead precisely,as directed by the computer system, in a direction that is orthogonal tothe direction of travel, or by actuators that are configured to drivethe carrier substrate 200 as directed by the computer system, in adirection that is orthogonal to the direction of travel.

In various implementations, the alignment sensor 35 may include sensorsconfigured to precisely determine the location of alignment fiducialmarks 204 deposited with or in the adjustable binder/powder object. Whenthe location of the alignment fiducial marks 204 relative to theprinthead is precisely known, and the relationship of the alignmentfiducial marks 204 is precisely known relative to the rest of theadjustable binder/powder object, the computer system may calculate thelocation adjustment needed to allow precise jetting of the primarybinder on the adjustable binder/powder object.

Fixing Device

In various implementations, the inkjet printer may also include, nearthe center of the carrier substrate 200, a fixing device 50. The fixingdevice 50 is positioned downstream from the binder printer along thedirection of travel of the carrier substrate 200. The fixing device 50may be configured to solidify the liquid binding material, thus fixingthe fluidized material exposed to the liquid binding material in arobust solid pattern. The fixing device 50 may be a source of radiantenergy that may interact with the liquid binding material to cause it tobecome solid. In some implementations, the radiant energy may be IRradiation, UV radiation, electron beam, or other known radiation types.Alternatively, the fixing device 50 may include a heat source. It shouldbe understood that the fixing device 50 may not be limited to thedisclosed radiation types, as this list is presented for exemplaryimplementations and not intended to be exhaustive. Alternatively, thefixing device 50 may include a device for dispersing a reactive agent.The reactive agent may be configured to react with the liquid bindingmaterial and the fluidized material to convert the fluidized material toa robust mass.

Fluidized Material Removal Device

In various implementations, the inkjet printer may also include afluidized materials removal device 60 further downstream, relatively tomovement of the carrier substrate 200, from the fixing device 50. Thefluidized materials removal device 60 is sometimes referred to as amaterial removal module. The material removal module is positioneddownstream from the fixing device 50 along the direction of travel. Thefluidized materials removal device 60 may be configured to remove mostor all of the fluidized material deposited and compacted onto thecarrier substrate 200. The fluidized materials removal device 60 mayremove the fluidized material deposited and compacted onto the carriersubstrate, but not fixed in place by the liquid binder material.

Transfer Module

In addition to carrier substrate 200, transfer module B may include oneor more buffers 212, 210 and a transfer device 76. Carrier substrate 200may include an endless loop (endless belt) of mechanically stablematerial such as, but not limited to, a steel alloy, a copper alloy or apolymeric material. Carrier substrate 200 may also include amechanically stable material coated with a material to control adhesionof printed objects to the carrier substrate 200. The adhesion controlmaterial coated on carrier substrate 200 may be chosen to control theadhesion of printed material within a desired range for the 3D printedmaterial of the current printed object. The adhesion control materialmay include for example, a silicone material, a fluoropolymer material,or a thin film metal such as gold.

As discussed above, each multi-method printer system may be providedwith a plurality of transfer modules B. In one implementation, onetransfer module B may be provided in communication with each one of aplurality of printer modules A. Transfer module B is positioneddownstream from the material removal module along the direction oftravel. A transfer module B may provide a substrate for the creation ofa printed object and cause the transfer of a printed object from thatsubstrate (carrier substrate 200) to assembly apparatus C. As shown inFIG. 2 , the transfer module B includes a carrier substrate 200, one ormore buffers 210 and/or 212, one or more transfer drive motors 250, 260,and a transfer area (also referred to as transfer zone) 240. In someimplementations, the proximal buffer 212 may be provided betweenfluidized materials removal device 60 and transfer area 240 in order tocoordinate the residence time of a 3D printed object relative totransfer area 240 with the components of jetted binder printer.

In an implementation, carrier substrate 200 may include a length offlexible material that may be scaled such that its width is equal to orwider than the build plate 80. The material of carrier substrate 200 maybe or include, but is not limited to, a steel alloy or a polymericmaterial such as polyester or polytetrafluoroethylene, or a compositematerial. The surface of the carrier substrate 200 may be chosen tocontrol the adhesion between carrier substrate 200 and the materials tobe printed by the associated printer module. In one implementation,carrier substrate 200 may include a loop of material that may traversetransfer module B from a distal buffer 210 through a proximal buffer 212and back through a transfer device 76 to a proximal buffer 212.

In various implementations, carrier substrate 200 may be moved bytransfer drive motor 250 and by transfer drive motor 260. Carriersubstrate 200 may also be provided with additional devices forcontrolling the movement of carrier substrate 200 in compliance with therequirements of the individual steps of printed object formation andtransfer to build station 110. Transfer device 76 may be implementeddownstream, relative to the progressive movement of carrier substrate200, from the fluidized materials removal device 60. Movement of a 3Dprinted object on carrier substrate 200 through transfer area 240 may becoordinated by distal buffer 210 and transfer drive motor 260, which maybe controlled by the computer system of FIGS. 4 and 5 .

Assembly Apparatus

Assembly apparatus C, a portion of which is illustrated in FIG. 3 , mayinclude a X-Y positioner device 230 and a build station 110. Buildstation 110 may include a build plate 80. A Z axis positioner device 100(vertical positioner) may be provided which may adjust the verticalposition of build plate 80 to maintain the level of the top ofpreviously transferred printed objects 90 at a desired vertical positionto facilitate proper transfer of a printed object to build plate 80 orthe top of a stack of previously transferred printed objects 90. Thecompleted assembly of the patterned single-layer objects on the buildplate is fused together under conditions suitable for the materialsinvolved.

FIG. 3 is an illustration of a carrier substrate 200, according tovarious implementations. Precise alignment of the primary binder patternwith adjustable binder pattern may be accomplished by incorporating oneor more alignment fiducial marks 204 in the adjustable binder patternshown in FIG. 3 . The alignment device 35 described above with respectto FIG. 2 may be in a known relation to the primary binder printer 40and may sense the location of alignment fiducial marks 204. From theknown locations of alignment fiducial marks 204 and the relationshipbetween primary binder printer 40 and alignment device 35, the preciselocations of all pixels comprising adjustable binder pattern 202 may becalculated and used to print the desired pattern of primary binder overthe adjustable binder pattern. The primary binder pattern may match theadjustable binder pattern 202 exactly or the primary binder pattern maybe adjusted in a desired way to compensate features of the adjustablebinder/flowable powder structure. In some implementations, alignmentfiducial marks may be incorporated in the active portion of adjustablebinder pattern 202.

In various implementations, the alignment device 35 discussed above withrespect to FIG. 2 may sense the precise location of alignment fiducialmarks 204 using sensing technology based on, but not limited to,electromagnetic radiation in the visible, infrared and/or ultravioletspectrum, magnetic detection, capacitive sensing, or ultrasonic sensing.

In another implementation, alignment of the adjustable binder patternand the primary binder pattern may be accomplished by precisely aligningthe primary binder printer to the adjustable binder printer relativelyto an edge of carrier substrate 200 and separated by, e.g., a knowndistance. In this implementation, an encoder 206 capable of a desiredprecision may be incorporated in the carrier substrate or in a systemproviding locomotion in the direction of travel, or in a sensorprecisely sensing the movement of carrier substrate 200 in the directionof travel. With the location of the adjustable binder pattern relativeto an edge of the carrier substrate 200, the adjusted pattern of primarybinder may be precisely applied by indexing carrier substrate 200 by thedistance separating the adjustable binder printer 45 and the primarybinder printer 40.

In another implementation, alignment of the adjustable binder patternand the primary binder pattern may be accomplished by providing encodersthat sense both the movement of carrier substrate 200 parallel to thedirection of travel and orthogonal to the directions of travel. Knowingthe precise position of carrier substrate 200 when the adjustable binderwas printed and the precise relative location of adjustable binderprinter 45 to primary binder printer 40 allows the adjustable binderpattern on carrier substrate 200 to be moved to a location where theadjusted primary binder pattern may be calculated and printed by primarybinder printer 40.

FIG. 4 is a diagram of a computer system configured to control a 3Dinkjet printer, according to various implementations. Computer system1400 for controlling the 3D inkjet printer of FIG. 2 is illustrated inFIG. 4 . Central processing unit (CPU) 1402 communicates with inputdevice 1404, which may be supplied with a design file 1406. In someimplementations, a user may create design file 1406 using CAD softwareor the like, either on computer system 1400 or on another computer. Inother implementations, a user may receive a design file from a filerepository, such as Thingiverse, Pinshape, or other file-sharing sites,or from a commercial vendor of 3D designs. CPU 1402 may store designfile 1406 or intermediate calculations for control of the print stationcontrol units 1408 in memory 1410 and may communicate with the user viaoutput device 1412. CPU 1402 may communicate through interface bus 1414with a plurality of print station control units 1408 to controldispensing of ink from inkjet print heads as discussed above and otherfunctions of the print station control units 1408.

FIG. 5 is a schematic of a print station controller for use with a 3Dinkjet printer, according to various implementations. As shown in FIG. 5, print station control units 1408 may communicate via a devicecontroller 1502 with the various devices and modules discussed above,controlling each of, or at least one of, these devices or modules inorder to deposit ink as specified by design file 1406 as interpreted byCPU 1402. CPU 1402 may receive state information and sensor information,and may send control signals, to any of these devices using controlsignaling systems that are known in the art, in order to facilitateprinting as described herein.

FIG. 6 is a block diagram of an example computing device configured toprovide implementations of the systems and methods described herein.FIG. 6 is a block diagram 1600 illustrating an example softwarearchitecture 1602, various portions of which may be used in conjunctionwith various hardware architectures herein described, which mayimplement any of the above-described features. FIG. 6 is a non-limitingexample of a software architecture and it will be appreciated that manyother architectures may be implemented to facilitate the functionalitydescribed herein. The software architecture 1602 may execute on hardwaresuch as the central processing unit 1402 that may include, among otherthings, document storage, processors, memory, and input/output (I/O)components. A representative hardware layer 1604 is illustrated and mayrepresent, for example, the devices described herein. The representativehardware layer 1604 includes a processing unit 1606 and associatedexecutable instructions 1608. The executable instructions 1608 representexecutable instructions of the software architecture 1602, includingimplementation of the methods, modules and so forth described herein.The hardware layer 1604 also includes a memory/storage 1610, which alsoincludes the executable instructions 1608 and accompanying data. Thehardware layer 1604 may also include other hardware modules 1612.Instructions 1608 held by processing unit 1608 may be portions ofinstructions 1608 held by the memory/storage 1610.

The example software architecture 1602 may be conceptualized as layers,each providing various functionality. For example, the softwarearchitecture 1602 may include layers and components such as an operatingsystem (OS) 1614, libraries 1616, frameworks 1618, applications 1620,and a presentation layer 1644. Operationally, the applications 1620and/or other components within the layers may invoke API calls 1624 toother layers and receive corresponding results 1626. The layersillustrated are representative in nature and other softwarearchitectures may include additional or different layers. For example,some mobile or special purpose operating systems may not provide theframeworks/middleware 1618.

The OS 1614 may manage hardware resources and provide common services.The OS 1614 may include, for example, a kernel 1628, services 1630, anddrivers 1632. The kernel 1628 may act as an abstraction layer betweenthe hardware layer 1604 and other software layers. For example, thekernel 1628 may be responsible for memory management, processormanagement (for example, scheduling), component management, networking,security settings, and so on. The services 1630 may provide other commonservices for the other software layers. The drivers 1632 may beresponsible for controlling or interfacing with the underlying hardwarelayer 1604. For instance, the drivers 1632 may include display drivers,camera drivers, memory/storage drivers, peripheral device drivers (forexample, via Universal Serial Bus (USB)), network and/or wirelesscommunication drivers, audio drivers, and so forth depending on thehardware and/or software configuration.

The libraries 1616 may provide a common infrastructure that may be usedby the applications 1620 and/or other components and/or layers. Thelibraries 1616 typically provide functionality for use by other softwaremodules to perform tasks, rather than rather than interacting directlywith the OS 1614. The libraries 1616 may include system libraries 1634(for example, C standard library) that may provide functions such asmemory allocation, string manipulation, file operations. In addition,the libraries 1616 may include API libraries 1636 such as medialibraries (for example, supporting presentation and manipulation ofimage, sound, and/or video data formats), graphics libraries (forexample, an OpenGL library for rendering 2D and 3D graphics on adisplay), database libraries (for example, SQLite or other relationaldatabase functions), and web libraries (for example, WebKit that mayprovide web browsing functionality). The libraries 1616 may also includea wide variety of other libraries 1638 to provide many functions forapplications 1620 and other software modules.

The frameworks 1618 (also sometimes referred to as middleware) provide ahigher-level common infrastructure that may be used by the applications1620 and/or other software modules. For example, the frameworks 1618 mayprovide various graphic user interface (GUI) functions, high-levelresource management, or high-level location services. The frameworks1618 may provide a broad spectrum of other APIs for applications 1620and/or other software modules.

The applications 1620 include built-in applications 1640 and/orthird-party applications 1642. Examples of built-in applications 1640may include, but are not limited to, a contacts application, a browserapplication, a location application, a media application, a messagingapplication, and/or a game application. Third-party applications 1642may include any applications developed by an entity other than thevendor of the particular platform. The applications 1620 may usefunctions available via OS 1614, libraries 1616, frameworks 1618, andpresentation layer 1644 to create user interfaces to interact withusers.

Some software architectures use virtual machines, as illustrated by avirtual machine 1648. The virtual machine 1648 provides an executionenvironment where applications/modules may execute as if they wereexecuting on a hardware machine. The virtual machine 1648 may be hostedby a host OS (for example, OS 1614) or hypervisor, and may have avirtual machine monitor 1646 which manages operation of the virtualmachine 1648 and interoperation with the host operating system. Asoftware architecture, which may be different from software architecture1602 outside of the virtual machine, executes within the virtual machine1648 such as an OS 1650, libraries 1652, frameworks 1654, applications1656, and/or a presentation layer 1658.

FIG. 7 is a block diagram illustrating components of an example machine1700 configured to read instructions from a machine-readable medium (forexample, a machine-readable storage medium) and perform any of thefeatures described herein. The example machine 1700 is in a form of acomputer system, within which instructions 1716 (for example, in theform of software components) for causing the machine 1700 to perform anyof the features described herein may be executed. As such, theinstructions 1716 may be used to implement modules or componentsdescribed herein. The instructions 1716 cause unprogrammed and/orunconfigured machine 1700 to operate as a particular machine configuredto carry out the described features. The machine 1700 may be configuredto operate as a standalone device or may be coupled (for example,networked) to other machines. In a networked deployment, the machine1700 may operate in the capacity of a server machine or a client machinein a server-client network environment, or as a node in a peer-to-peeror distributed network environment. Machine 1700 may be embodied as, forexample, a server computer, a client computer, a personal computer (PC),a tablet computer, a laptop computer, a netbook, a set-top box (STB), agaming and/or entertainment system, a smart phone, a mobile device, awearable device (for example, a smart watch), and an Internet of Things(IoT) device. Further, although only a single machine 1700 isillustrated, the term “machine” includes a collection of machines thatindividually or jointly execute the instructions 1716.

The machine 1700 may include processors 1710, memory 1730, and I/Ocomponents 1750, which may be communicatively coupled via, for example,a bus 1702. The bus 1702 may include multiple buses coupling variouselements of machine 1700 via various bus technologies and protocols. Inan example, the processors 1710 (including, for example, a centralprocessing unit (CPU), a graphics processing unit (GPU), a digitalsignal processor (DSP), an ASIC, or a suitable combination thereof) mayinclude one or more processors 1712 a to 1712 n that may execute theinstructions 1716 and process data. In some examples, one or moreprocessors 1710 may execute instructions provided or identified by oneor more other processors 1710. The term “processor” includes amulti-core processor including cores that may execute instructionscontemporaneously. Although FIG. 7 shows multiple processors, themachine 1700 may include a single processor with a single core, a singleprocessor with multiple cores (for example, a multi-core processor),multiple processors each with a single core, multiple processors eachwith multiple cores, or any combination thereof. In some examples, themachine 1700 may include multiple processors distributed among multiplemachines.

The memory/storage 1730 may include a main memory 1732, a static memory1734, or other memory, and a storage unit 1736, both accessible to theprocessors 1710 such as via the bus 1702. The storage unit 1736 andmemory 1732, 1734 store instructions 1716 embodying any one or more ofthe functions described herein. The memory/storage 1730 may also storetemporary, intermediate, and/or long-term data for processors 1710. Theinstructions 1716 may also reside, completely or partially, within thememory 1732, 1734, within the storage unit 1736, within at least one ofthe processors 1710 (for example, within a command buffer or cachememory), within memory at least one of I/O components 1750, or anysuitable combination thereof, during execution thereof. Accordingly, thememory 1732, 1734, the storage unit 1736, memory in processors 1710, andmemory in I/O components 1750 are examples of machine-readable media.

As used herein, “machine-readable medium” refers to a device able totemporarily or permanently store instructions and data that causemachine 1700 to operate in a specific fashion. The term“machine-readable medium,” as used herein, does not encompass transitoryelectrical or electromagnetic signals per se (such as on a carrier wavepropagating through a medium); the term “machine-readable medium” maytherefore be considered tangible and non-transitory. Non-limitingexamples of a non-transitory, tangible machine-readable medium mayinclude, but are not limited to, nonvolatile memory (such as flashmemory or read-only memory (ROM)), volatile memory (such as a staticrandom-access memory (RAM) or a dynamic RAM), buffer memory, cachememory, optical storage media, magnetic storage media and devices,network-accessible or cloud storage, other types of storage, and/or anysuitable combination thereof. The term “machine-readable medium” appliesto a single medium, or combination of multiple media, used to storeinstructions (for example, instructions 1716) for execution by a machine1700 such that the instructions, when executed by one or more processors1710 of the machine 1700, cause the machine 1700 to perform and one ormore of the features described herein. Accordingly, a “machine-readablemedium” may refer to a single storage device, as well as “cloud-based”storage systems or storage networks that include multiple storageapparatus or devices.

The I/O components 1750 may include a wide variety of hardwarecomponents adapted to receive input, provide output, produce output,transmit information, exchange information, capture measurements, and soon. The specific I/O components 1750 included in a particular machinewill depend on the type and/or function of the machine. For example,mobile devices such as mobile phones may include a touch input device,whereas a headless server or IoT device may not include such a touchinput device. The particular examples of I/O components illustrated inFIG. 7 are in no way limiting, and other types of components may beincluded in machine 1700. The grouping of I/O components 1750 are merelyfor simplifying this discussion, and the grouping is in no way limiting.In various examples, the I/O components 1750 may include user outputcomponents 1752 and user input components 1754. User output components1752 may include, for example, display components for displayinginformation (for example, a liquid crystal display (LCD) or aprojector), acoustic components (for example, speakers), hapticcomponents (for example, a vibratory motor or force-feedback device),and/or other signal generators. User input components 1754 may include,for example, alphanumeric input components (for example, a keyboard or atouch screen), pointing components (for example, a mouse device, atouchpad, or another pointing instrument), and/or tactile inputcomponents (for example, a physical button or a touch screen thatprovides location and/or force of touches or touch gestures) configuredfor receiving various user inputs, such as user commands and/orselections.

In some examples, the I/O components 1750 may include biometriccomponents 1756, motion components 1758, environmental components 1760,and/or position components 1762, among a wide array of other possiblesensor components. The biometric components 1756 may include, forexample, components to detect body expressions (for example, facialexpressions, vocal expressions, hand or body gestures, or eye tracking),measure biosignals (for example, heart rate or brain waves), andidentify a person (for example, via voice-, retina-, and/or facial-basedidentification). The motion components may include, for example,acceleration and/or rotation sensors for various components of the 3Dprinter. The environmental components may include, for example, lightsensors (for example, photodiodes, photoresistors, or phototransistors),acoustic sensors (for example, piezoelectric sensors or acoustic wavesensors), or temperature sensors (for example, thermocouples orthermistors), which may sense environmental conditions for variouslocations in the 3D printer. The position components 1762 may include,for example, location sensors (for example, a Global Position System(GPS) receiver), altitude sensors (for example, an air pressure sensorfrom which altitude may be derived), and/or orientation sensors (forexample, magnetometers).

The I/O components 1750 may include communication components 1764,implementing a wide variety of technologies operable to couple themachine 1304 to network(s) 1770 and/or device(s) 1780 via respectivecommunicative couplings 1772 and 1782. The communication components 1764may include one or more network interface components or other suitabledevices to interface with the network(s) 1770. The communicationcomponents 1764 may include, for example, components adapted to providewired communication, wireless communication, cellular communication,Near Field Communication (NFC), Bluetooth communication, Wi-Fi, and/orcommunication via other modalities. The device(s) 1780 may include othermachines or various peripheral devices (for example, coupled via USB).

In some examples, the communication components 1764 may detectidentifiers or include components adapted to detect identifiers. Forexample, the communication components 1764 may include Radio FrequencyIdentification (RFID) tag readers, NFC detectors, optical sensors (forexample, one- or multi-dimensional bar codes, or other optical codes),and/or acoustic detectors (for example, microphones to identify taggedaudio signals). In some examples, location information may be determinedbased on information from the communication components 1762, such as,but not limited to, geo-location via Internet Protocol (IP) address,location via Wi-Fi, cellular, NFC, Bluetooth, or other wireless stationidentification and/or signal triangulation.

In the following, further features, characteristics and advantages ofthe instant application will be described via the following items:

Item 1: A jetted binder printing system, including a carrier substrateconfigured to travel along a longitudinal direction thereof, anadjustable binder printer configured to deliver an adjustable binder tothe carrier substrate, a dispensing module located downstream from theadjustable binder printer on the longitudinal direction of the carriersubstrate, the dispensing module including at least one powdercontainer, the dispensing module being configured to dispense powderonto the carrier substrate, a compaction module located downstream fromthe dispensing module along the longitudinal direction of the carriersubstrate, the compaction module being configured to apply a controlledpressure, in a direction substantially orthogonal to the longitudinaldirection of the carrier substrate, to increase a compaction of thedispensed powder to a desired compaction range, and a primary binderprinter located downstream from the compaction module along thelongitudinal direction of the carrier substrate, the primary binderprinter including a print head configured to print a primary binder onthe dispensed powder according to a desired pattern, wherein the primarybinder is printed on a surface of the powder that is opposite a surfaceon which the adjustable binder is printed; and wherein the primarybinder is printed to coordinate with the pattern of the adjustablebinder. For example, the primary binder may be slightly offset withrespect to the adjustable binder so as to compensate for any movement inthe adjustable binder and/or in the powder, and to compensate for anymovement in the primary binder after deposition.

Item 2: The printer of item 1, wherein the adjustable binder iscompatible with the primary binder.

Item 3: The printer of item 1 or 2, wherein the adjustable binder isconfigured to maintain a position of the powder.

Item 4: The printer of any of items 1-3, wherein the adjustable binderis configured to provide adhesion to the powder and to the primarybinder.

Item 5: The printer of any of items 1-4, further including a fusionmodule positioned downstream from the primary binder printer along thelongitudinal direction of the carrier substrate, the fusion moduleincluding an energy source and being configured to cause selectivefusion of the material layer according to the desired pattern, amaterial removal module positioned downstream from the fusion modulealong the longitudinal direction of the carrier substrate, the materialremoval module including a plurality of material removal devices andbeing configured to remove non-fused portions of the material layer toform one or more patterned single-layer objects, a transfer modulelocated downstream from the material removal module along thelongitudinal direction of the carrier substrate, the transfer moduleconfigured to transfer the one of the one or more patterned single-layerobjects from the carrier substrate to an assembly plate, an assemblystation comprising the assembly plate, the patterned single-layerobjects being assembled into a stack on the assembly plate according toa desired sequence of objects including the patterned single-layerobjects, and a controller to control the desired sequence and desiredpatterns.

Item 6: The printer of any of items 1-5, wherein the carrier substrateis a belt.

Item 7: The printer of any of items 1-6, wherein the carrier substratefurther comprises an adhesion control layer on which the material layeris formed.

Item 8: The printer of any of items 1-7, wherein the dispensing modulecomprises one or more powder containers configured to contain afluidized powder in a desired controlled condition.

Item 9: The printer of any of items 1-8, wherein the dispensing modulecomprises one or more dispensing controllers configured to meter adesired amount of powder dispensed onto the carrier substrate.

Item 10: The printer of any of items 1-9, wherein the dispensing modulecomprises one or more dispensing rollers configured to spread the powderon the carrier substrate.

Item 11: The printer of any of items 1-10, wherein the compactor modulecomprises a vibratory energy source to cause settling of the powder.

Item 12: The printer of any of items 1-11, wherein the print headcomprises an ink jet print head.

Item 13: The printer of any of items 1-12, wherein the assembly stationfurther including a lateral positioner to laterally displace theassembly plate, and a vertical positioner to vertically displace theassembly plate.

Item 14: The printer of any of items 1-13, wherein the carrier substratecomprises a fiducial marker for each of the patterned single-layerobjects; and the assembly station comprises an alignment sensor to alignthe fiducial markers to the assembly plate.

Item 15: A method of manufacturing a three-dimensional object includingdispensing an adjustable binder on a longitudinal surface of a carriersubstrate according to a desired pattern, dispensing a powder on theadjustable binder on the carrier substrate, compacting the powder to adesired compaction range, dispensing a primary binder on the compactedpowder according to the desired pattern, selectively fusing thecompacted powder according to the desired pattern, and removingnon-fused portions of the compacted powder to form one of a patternedsingle-layer object.

Item 16: The method of item 15, further including transferring thepatterned single-layer object from the carrier substrate to an assemblyplate, and repeating the dispensing the adjustable binder, thedispensing the powder on the adjustable binder, the compacting thepowder, the dispensing the primary binder, the selectively fusing thecompacted powder and the removing the non-fused portions, to form apatterned multi-layer object.

Item 17: The method of any of items 15-16, wherein the dispensing theadjustable binder comprises defining a position of the powder.

Item 18: The method of any of items 15-17, wherein the printing thepowder comprises adhering the powder to the adjustable binder at thedefined position.

While various implementations have been described, the description isintended to be exemplary, rather than limiting, and it is understoodthat many more implementations and implementations are possible that arewithin the scope of the implementations. Although many possiblecombinations of features are shown in the accompanying figures anddiscussed in this detailed description, many other combinations of thedisclosed features are possible. Any feature of any implementation maybe used in combination with or substituted for any other feature orelement in any other implementation unless specifically restricted.Therefore, it will be understood that any of the features shown and/ordiscussed in the present disclosure may be implemented together in anysuitable combination. Accordingly, the implementations are not to berestricted except in light of the attached claims and their equivalents.Also, various modifications and changes may be made within the scope ofthe attached claims.

While the foregoing has described what are considered to be the bestmode and/or other examples, it is understood that various modificationsmay be made therein and that the subject matter disclosed herein may beimplemented in various forms and examples, and that the teachings may beapplied in numerous applications, only some of which have been describedherein. It is intended by the following claims to claim any and allapplications, modifications and variations that fall within the truescope of the present teachings.

Unless otherwise stated, all measurements, values, ratings, positions,magnitudes, sizes, and other specifications that are set forth in thisspecification, including in the claims that follow, are approximate, notexact. They are intended to have a reasonable range that is consistentwith the functions to which they relate and with what is customary inthe art to which they pertain.

The scope of protection is limited solely by the claims that now follow.That scope is intended and should be interpreted to be as broad as isconsistent with the ordinary meaning of the language that is used in theclaims when interpreted in light of this specification and theprosecution history that follows and to encompass all structural andfunctional equivalents.

Notwithstanding, none of the claims are intended to embrace subjectmatter that fails to satisfy the requirement of Sections 101, 102, or103 of the Patent Act, nor should they be interpreted in such a way. Anyunintended embracement of such subject matter is hereby disclaimed.

Except as stated immediately above, nothing that has been stated orillustrated is intended or should be interpreted to cause a dedicationof any component, step, feature, object, benefit, advantage, orequivalent to the public, regardless of whether it is or is not recitedin the claims.

It will be understood that the terms and expressions used herein havethe ordinary meaning as is accorded to such terms and expressions withrespect to their corresponding respective areas of inquiry and studyexcept where specific meanings have otherwise been set forth herein.Relational terms such as first and second and the like may be usedsolely to distinguish one entity or action from another withoutnecessarily requiring or implying any actual such relationship or orderbetween such entities or actions. The terms “comprises,” “comprising,”or any other variation thereof, are intended to cover a non-exclusiveinclusion, such that a process, method, article, or apparatus thatincludes a list of elements does not include only those elements but mayinclude other elements not expressly listed or inherent to such process,method, article, or apparatus. An element proceeded by “a” or “an” doesnot, without further constraints, preclude the existence of additionalidentical elements in the process, method, article, or apparatus thatincludes the element.

The Abstract of the Disclosure is provided to allow the reader toquickly ascertain the nature of the technical disclosure. It issubmitted with the understanding that it will not be used to interpretor limit the scope or meaning of the claims. In addition, in theforegoing Detailed Description, it may be seen that various features aregrouped together in various examples for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the claims require more features than areexpressly recited in each claim. Rather, as the following claimsreflect, inventive subject matter lies in less than all features of asingle disclosed example. Thus, the following claims are herebyincorporated into the Detailed Description, with each claim standing onits own as a separately claimed subject matter.

What is claimed is:
 1. A system for manufacturing a three-dimensionalobject comprising: one or more processors; and one or moremachine-readable media storing instructions which, when executed by theone or more processors, cause the system to: dispense an adjustablebinder from a print head of a binder printer onto a longitudinal surfaceof a carrier substrate according to a desired pattern; dispense a powderfrom a dispensing module on the adjustable binder on the carriersubstrate to create an adjustable binder/powder mixture; and dispense aprimary binder from the print head of the binder printer on theadjustable binder/powder mixture according to the desired pattern tocreate a binder/powder object, wherein the instructions further causethe system to compact the adjustable binder/powder mixture using acompaction module to a desired compaction range following dispensing ofthe adjustable binder and the powder and prior to dispensing of theprimary binder.
 2. The system of claim 1, wherein the instructionsfurther cause the system to move the carrier substrate to move thedispensed powder upstream, after the dispensed powder has been compactedby the compaction module, to return the dispensed powder to the binderprinter to receive the primary binder.
 3. The system of claim 1, whereinthe carrier substrate is located at a fixed location and wherein theinstructions further cause the system to move the print head of thebinder printer in a direction of travel and a direction reverse to thedirection of travel.
 4. The system of claim 1, wherein the instructionsfurther cause the system to move the carrier substrate in a direction oftravel and a direction reverse to the direction of travel to receive thedispensed adjustable binder, the dispensed powder, and the dispensedprimary binder.
 5. The system of claim 1, wherein the instructionsfurther cause the system to deposit a fiducial marker with or in theadjustable binder or the powder via a depositing module.
 6. The systemof claim 5, wherein the instructions further cause the system to sense alocation of the fiducial marker via a sensor.
 7. The system of claim 6,wherein the instructions further cause the system to determine alocation adjustment needed to enable jetting of the primary binder onthe adjustable binder/powder mixture based on the sensed location of thefiducial marker.
 8. The system of claim 7, wherein the instructionsfurther cause the system to activate an alignment actuator to adjust arelationship between the adjustable binder/powder mixture and the printhead of the binder printer based on the sensed location of the fiducialmarker.
 9. The system of claim 1, wherein the instructions further causethe system to activate the compaction module to apply a controlledpressure, in a direction substantially orthogonal to the longitudinaldirection of the carrier substrate, to increase compaction of thedispensed powder to the desired compaction range.
 10. The system ofclaim 1, wherein the instructions further cause the system to activatethe binder printer to print the primary binder on the dispensed powderon a surface of the powder that is opposite a surface on which theadjustable binder is printed according to a desired pattern.
 11. Thesystem of claim 10, wherein the instructions further cause the system toactivate the binder printer to print the primary binder to coordinatewith the pattern of the adjustable binder.
 12. The system of claim 1,wherein the instructions further cause the system to activate the binderprinter to deposit fiducial markers with or in the adjustable binder.13. The system of claim 1, wherein the instructions further cause thesystem to activate the binder printer to deposit fiducial markers withor in the dispensed powder.
 14. The system of claim 1, wherein theinstructions further cause the system to activate the binder printer todeposit a fiducial marker in the adjustable binder, and the systemfurther comprises a sensor configured to determine a location of thefiducial marker based on instructions from the system.
 15. The system ofclaim 14, wherein the instructions further cause the system to determinea need to make a location adjustment to enable jetting of the primarybinder on the dispensed powder based on the sensed location of thefiducial marker.
 16. The system of claim 15, wherein the instructionsfurther cause the system to activate an alignment actuator to adjust arelationship between the dispensed powder and the print head of thebinder printer based on the sensed location of the fiducial marker.